Influence of Parameters and Regimes of the Electrodeposition on Hardness of Copper Coatings

Correlation among morphological, structural and hardness characteristics of electrodeposited copper coatings is presented in this review paper. Cu were produced applying constant galvanostatic (DC) pulsating current (PC) regimes on hard silicon (Si(111)) brass substrates. The parameters the electrochemical deposition analyzed, which include kinds electrolyte cathode, coating thickness stirring, as well defining PC regime, such average density amplitude, analyzed. Morphology structure examined by scanning electron microscope (SEM), atomic force (AFM) X-ray diffraction (XRD), while was Vickers microindentation. both Si(111) cathodes belong to “soft film (coating) substrate” composite system, Chicot–Lesage (C–L) model applied estimate a coatings. Analyzing electrodeposition, critical relative indentation depth (RID)c 0.14 has been defined C–L model. Based done analyses, it shown that RID value, separating zone where measured corresponds necessary apply determine an absolute coatings, universal character for electrolytically